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Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability

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Please use this identifier to cite or link to this item: http://hdl.handle.net/1928/17425

Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability

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Title: Predicting adhesive failure initiation of an epoxy bond for electronic packaging survivability
Author: Elisberg, Brenton Adam
Advisor(s): Khraishi, Tariq
Committee Member(s): Shen, Yu-Lin
Chambers, Robert S.
Department: University of New Mexico. Dept. of Mechanical Engineering
Subject(s): Adhesive Failure
Thermoset debonding
nonlinear viscoelastic behavior
maximum principal strain failure criteria
LC Subject(s): Electronic packaging-- Materials--Fatigue.
Epoxy resins--Fatigue.
Thermosetting composites--Fatigue.
Degree Level: Masters
Abstract: Epoxy underfills can be implemented in electronic packaging to enhance solder joint reliability of surface mounted components. However, it is important for an engineer to have a failure criterion that can be used for failure predictions and redesign of electronic assemblies. Data from epoxy bond failure in mock electronic part assemblies were correlated to finite element analyses to predict adhesive failure initiation. Experiments were performed to determine failure loads for various loading locations and nonlinear viscoelastic analyses were performed for the same loading locations to determine a maximum principal strain failure parameter. Predictions showed that a maximum principal strain failure parameter defined from one test could be used as an indicator of adhesive failure of an epoxy bond undergoing other modes of loading. Failure initiation predictions matched experimental data using a maximum principal strain failure parameter for an epoxy bond undergoing mixed modes of loading for both unfilled and alumina oxide filled 828DEA epoxy.
Graduation Date: December 2011
URI: http://hdl.handle.net/1928/17425

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